samsputtertargets

samsputtertargets

a posté un article :

Technical characteristics of plasma spraying equipment
Plasma spraying is a physical vapor deposition method, other pvd methods includes magnetron sputtering and vacuum evaporation. The plasma spray equipment power supply uses three opposite star thyristor (SCR) rectifier power suppli...

Jeudi 15 Novembre 2018 à 07:16

samsputtertargets

a posté un article :

What is sputtering? Definition | Principle | Use | Method | Features
Definition Sputtering is a kind of preparation technology of PVD (physical vapor deposition) thin film. Sputtering can be mainly divided into four categories: DC sputtering, AC sputtering, reactive sputtering and magnetron sputtering.  ...

Vendredi 19 Octobre 2018 à 03:16

samsputtertargets

a posté un article :

Target bonding and Analysis of Back Target Shedding
Target bonding is a very important step in sputter coating, which extends the life of the target and improves the performance of the target. Target bonding, as its name suggests, is the welding of the sputtering target to the back targ...

Jeudi 6 Septembre 2018 à 10:21

samsputtertargets

a posté un article :

What is Molecular Beam Epitaxy?
Molecular beam epitaxy is a new crystal growth technique, abbreviated as MBE. In an ultra-high vacuum chamber, the source material is subjected to high-temperature evaporation, glow discharge ionization, gas cracking and electron beam heati...

Mardi 28 Août 2018 à 07:37

samsputtertargets

a posté un article :

Manufacturing Process of LED Chip
The basic manufacturing Process of LED Chip is shown below. Epitaxial wafer → cleaning → plating transparent electrode layer → transparent electrode pattern lithography → corrosion → debonding → platform patter...

Lundi 20 Août 2018 à 11:19